Product Information

Hermetic Package Lids

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On the surface, lids for hermetic microelectronic packaging may not seem like the most exciting piece of the electronic packaging equation. Often, there are many technical attributes in designing and manufacturing a new device. Unless a radical new packaging technique is also being developed, the lid used for sealing is often taken for granted. However, Qnnect gets it; we are a supplier who thoroughly understands the hermetic lid sealing process and the fundamental differences and requirements of different techniques. Chemical etching, stamping, deep drawn, solder seal, and window integration are among Qnnect’s lid manufacturing capabilities. Specific application will dictate which of these technologies will be employed to meet specific customer requirements. Metal options include ASTM-F15 alloys (Kovar, 42, 46, 48, and 49) to 300/400 Series stainless steel, to cold rolled steel while window material options include borosilicate and sapphire, depending on the specific customer requirements.

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About us

Hi-Rel Group, part of the Qnnect portfolio, has been a key player in the microelectronic packaging industry since its establishment in 1976.

Renowned for our expertise, we specialise in manufacturing intricate metal components tailored to the industry's unique requirements. Our diverse product range encompasses getters, absorbers, covers, ring frames, thermal management solutions, preforms, and more. With a strong commitment to excellence, we continue to deliver highly specialized and reliable solutions to the microelectronic packaging industry.

Our manufacturing operations are distributed among three specialized facilities: Hi-Rel Products, Hi-Rel Alloys, and Hi-Rel Lids. Each facility has its distinct expertise, focusing on a core specialty within our production process. By combining the strengths of these facilities, we are able to offer customers comprehensive turnkey solutions that deliver high performance and meet their specific needs.

Common Materials Include:

Pure Mo, Cu or W
Laminate materials; CMC, CPC and SCPC
Mo/Cu and W/Cu composites
Metal Matrix Composites: aluminum, copper and silver diamond
PCD – Polycrystalline diamond
MCD – Mono-crystalline diamond

Hi-Rel provides a wide selection of materials that can be utilized for package bases, flanges, and as die sub-mount tabs. Our materials are carefully chosen to meet the demands of high-performance applications, ensuring exceptional material performance, accommodating complex geometries, maintaining tight tolerances, and adhering to the highest-quality standards. We strive to deliver materials that fulfill your specific requirements and exceed your expectations.

Hi-Rel Group Product & Service Offerings

Getter Solutions

Products Include:

Moisture Getters
H2 Getters
CO2 Getters
02 Getters
Organics Getters
Multiple Contaminant Getters

Hermetic Package Lids & Assembly

Products Include:

Stepped / Flat Lids
Solder Seal Lids
Domed Lids & Cans
Window Lids
Solder & Braze Preforms

Thermal Management Solutions

Products Include:

Thermal Tabs
Thermal Management Base Plates
Heat Dissipation Materials
Thermal Spreaders

Precision Support Components

Products Include:

Lead Frames
Ring Frames
Vapor Deposition Materials

We're pleased to annouce we'll be exhibiting at ECOC 2023 this October!! Please come and see us on stand 957.

Your feedback is valuable to us!

We are eager to engage with you, whether it's to discuss a specific requirement or to address any general technical or industry-related inquiries you may have. Our team is ready to assist you and provide the information and support you need. We welcome the opportunity to have a conversation and provide the assistance you are seeking. Feel free to reach out to us, and we'll be happy to speak with you.