Product Information

Solder Seal Lids

Stockcode:

Solder seal lids, typically used to seal ceramic packages, combine the lid and an accurately aligned solder preform into a single unit. This type of assembly makes it easier to position the lid on the package, as the solder is already fixed in place. This type of lid delivers significant advantages over using separate lid and solder preform components.

Solder seal lids from the Hermetic Solutions Group are typically manufactured in Kovar, Invar and alloy 42/45/48. They can be plated with electrolytic and electroless nickel as well as soft electrolytic gold. Flat, stepped, and drawn caps are common configurations and solder options include 80/20 AuSn (most common) but Sn/Ag and Sn/Pb solder is also possible.

Flat lids are typically used for solder seal lids, but stepped lids are also an option. Rapid prototyping is available in small volumes even when no standard tooling exists.

Let us help you identify the best solder seal lid solution for your application, package and hermetic sealing process!

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About us

Hi-Rel Group, part of the Qnnect portfolio, has been a key player in the microelectronic packaging industry since its establishment in 1976.

Renowned for our expertise, we specialise in manufacturing intricate metal components tailored to the industry's unique requirements. Our diverse product range encompasses getters, absorbers, covers, ring frames, thermal management solutions, preforms, and more. With a strong commitment to excellence, we continue to deliver highly specialized and reliable solutions to the microelectronic packaging industry.

Our manufacturing operations are distributed among three specialized facilities: Hi-Rel Products, Hi-Rel Alloys, and Hi-Rel Lids. Each facility has its distinct expertise, focusing on a core specialty within our production process. By combining the strengths of these facilities, we are able to offer customers comprehensive turnkey solutions that deliver high performance and meet their specific needs.

Common Materials Include:

Pure Mo, Cu or W
Laminate materials; CMC, CPC and SCPC
Mo/Cu and W/Cu composites
Metal Matrix Composites: aluminum, copper and silver diamond
PCD – Polycrystalline diamond
MCD – Mono-crystalline diamond

Hi-Rel provides a wide selection of materials that can be utilized for package bases, flanges, and as die sub-mount tabs. Our materials are carefully chosen to meet the demands of high-performance applications, ensuring exceptional material performance, accommodating complex geometries, maintaining tight tolerances, and adhering to the highest-quality standards. We strive to deliver materials that fulfill your specific requirements and exceed your expectations.

Hi-Rel Group Product & Service Offerings

Getter Solutions

Products Include:

Moisture Getters
H2 Getters
CO2 Getters
02 Getters
Organics Getters
Multiple Contaminant Getters

Hermetic Package Lids & Assembly

Products Include:

Stepped / Flat Lids
Solder Seal Lids
Domed Lids & Cans
Window Lids
Solder & Braze Preforms

Thermal Management Solutions

Products Include:

Thermal Tabs
Thermal Management Base Plates
Heat Dissipation Materials
Thermal Spreaders

Precision Support Components

Products Include:

Lead Frames
Ring Frames
Vapor Deposition Materials

We're pleased to annouce we'll be exhibiting at ECOC 2023 this October!! Please come and see us on stand 957.

Your feedback is valuable to us!

We are eager to engage with you, whether it's to discuss a specific requirement or to address any general technical or industry-related inquiries you may have. Our team is ready to assist you and provide the information and support you need. We welcome the opportunity to have a conversation and provide the assistance you are seeking. Feel free to reach out to us, and we'll be happy to speak with you.