Latest Articles
Articles 5531 to 5540 | Page 554 of 896
16 April 2018
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Data Physics to Exhibit at IMAC XXXVI Conference and Exposition on Structural Dynamics
Data Physics returns to IMAC, February 11 – 15, 2018 in Orlando, Florida.
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2018 Hands-On Modal Analysis Training Dates
Navcon Engineering has announced the 2018 schedule for their popular Hands-On Modal Analysis Training course.
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Darcey Quigley & Co are finalists at the Annual Credit Awards 2018
Darcey Quigley and Co, a commercial debt recovery specialist are one of four finalists for “Collections and Recovery Service Provider of the Year” at the flagship annual Credit Awards, due to take place in London on the 17th May 2018.
12 April 2018
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New Chilled Mirror Hygrometer from Michell with ALL-NEW sensor set to become the industry benchmark: Faster, more accurate and more rugged than ever.
The new Optidew range from Michell Instruments offers the fastest response to changes in humidity of any chilled mirror instrument on the market.
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Acoustic Fan Jackets
At Ferrari we offer a range of centrifugal and axial fans which can now be offered with a bespoke acoustic fan jacket.
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Behind the meter – reducing the impact of electricity price rises with the latest battery energy systems from Socomec
The clean power revolution is gathering pace – disrupting power generation around the world.
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Rittal Hits the Road with Routeco Live 2018
Rittal will again be joining Routeco Live in 2018, to showcase its renowned infrastructure solutions – widely specified as the No.1 choice for protecting critical equipment – and demonstrate how its products and services can address specific problems faced by different industries.
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BittWare Announces SmartNIC Shell for 100G NICs
BittWare has announced SmartNIC Shell, a suite of IP modules for building 100G network interface controllers (NICs) using Xilinx UltraScale FPGAs for hardware packet processing.
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New Improved Welding Wipes with Long Shelf Life
Very high alcohol content 90%.
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X-ES Introduces XPedite2570 3U VPX Xilinx UltraScale FPGA Module
Extreme Engineering Solutions (X-ES) has introduced the XPedite2570, a rugged FPGA processing module with a high-speed optical front-end interface. Equipped with an integrated Xilinx Kintex® UltraScale™ FPGA, the XPedite2570 optimises both cost and performance for high-bandwidth embedded computing applications.
Articles 5531 to 5540 | Page 554 of 896