Business Articles and Press Releases

Latest Articles

04 July 2011

• EPLAN Data Portal 2.0 - More data, more manufacturers, more functions

  Developed over two years ago, the EPLAN Data Portal integrates around 120,000 pieces of component and device data from numerous component manufacturers.

30 June 2011

• Small space? Save up to 50% with a Crest to Crest Wave Spring from TFC

  Crest-to-Crest Wave Springs from TFC Ltd, offer the unique advantage of assembly space savings when used to replace conventional helical coil springs.

27 June 2011

• Elesa has standard components for printing and paper processing machines

  The Elesa catalogue of standard machine components incorporates many ideally suited to machines within the printing and paper processing industries.

• Pearson Electronics Ultra thin high precision current monitors

  Alrad Electronics is pleased to announce that Pearson Electronics has recently designed several new current transformers with a thickness that is about 1/2 of the size of the in stock current transformers designed by Pearson.

• Sensortechnics’ Highly Sensitive LBA Differential Pressure Sensors Offer New Ultra-Low Pressure Ranges From 25 Pa

  Sensortechnics’ LBA differential pressure sensors are based on thermal mass flow measurement of air or gas through a micro-flow channel integrated within the silicon sensor chip. Due to the highly sensitive measuring principle the LBA sensor achieves excellent resolution and offset stability. The LBA series now offers, ultra-low pressure ranges from 25 Pa Full Scale in addition to the existing 250 Pa and 500 Pa ranges.

22 June 2011

• Outsourcing Marketing and PR to a specialist agency can be a wise investment

  ‘Sales and marketing are top concerns for small engineering firms’, according to a survey conducted by the (FPB) the Forum of Private Business.

21 June 2011

• Rittal announce new SE 8 Series of Free Standing Enclosures

  Rittal’s new SE 8 free-standing enclosure system is replacing the popular ES 5000 series.

• May 14th to 16th the Antwerp break Bulk shipping conference

  For 3 days in the middle of May the world of conventional and specialist shippers, ship owners and project forwarders came together in the Antwerp Expo to discuss the developments in the industry, the way forward and trends in the market place.

20 June 2011

• LAP measurement systems – non contact displacement measurement.

  LAP laser sensors measure dimensions without touching the object’s surface.

13 June 2011

• Master Bond low viscosity, room temperature curing Epoxy complies with FDA and USP Class VI requirements

  Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.