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PCB Cleaning
When cleaning assemblies (PCB cleaning, PCBA cleaning), the primary goal is to remove resin and flux residues from populated boards and hybrids as well as production related residues created by handling.
Even though in many low-end production processes the use of "no-clean" works well, high-end assemblies that will be employed in industries such as automotive, telecommunications, military, and aerospace, require the use of a specific PCB cleaning agent.
The targeted use of a PCB cleaning agent substantially affects all subsequent process steps such as wire bonding and conformal coating since it primarily removes the resin and activator residues. If left on the assemblies, residues can cause the improper adhesion of bonds which can lead to failures such as heel cracks or lift-offs. During the coating process, remaining residues can result in poor wettability and the delamination of the conformal coating which is known to cause assembly failures, i.e. in-field failures.
Even though in many low-end production processes the use of "no-clean" works well, high-end assemblies that will be employed in industries such as automotive, telecommunications, military, and aerospace, require the use of a specific PCB cleaning agent.
The targeted use of a PCB cleaning agent substantially affects all subsequent process steps such as wire bonding and conformal coating since it primarily removes the resin and activator residues. If left on the assemblies, residues can cause the improper adhesion of bonds which can lead to failures such as heel cracks or lift-offs. During the coating process, remaining residues can result in poor wettability and the delamination of the conformal coating which is known to cause assembly failures, i.e. in-field failures.
Stencil & Screen Cleaning
When manufacturing electronic assemblies, solder pastes, SMT adhesives or thick film pastes are printed or applied using stencils, pump print stencils or screens. Since solder paste residues and remaining SMT adhesives on the stencil surface and in the apertures can lead to misprints and sometimes hardening, a manual or an automated cleaning process for stencil or screen cleaning is a must.
Maintenance & Tool Cleaning
As part of a maintenance cleaning program, the most prevalent types of contamination, such as burnt-in fluxes and condensed gas emissions from the soldering process, must be removed to ensure a reliable and failure-free production process.
Other areas of maintenance cleaning include the cleaning of solder pallets and condensation traps, conveyor fingers as well as the reflow ovens and wave solder systems. Furthermore, the cleaning of dispensing needles is another application within maintenance cleaning.
ZESTRON offers aqueous based FAST® cleaning agents and modern solvents for maintenance and tool cleaning applications in the electronics manufacturing industry. These maintenance cleaning products can be used manually as well as in ultrasonic and spray equipment.
Other areas of maintenance cleaning include the cleaning of solder pallets and condensation traps, conveyor fingers as well as the reflow ovens and wave solder systems. Furthermore, the cleaning of dispensing needles is another application within maintenance cleaning.
ZESTRON offers aqueous based FAST® cleaning agents and modern solvents for maintenance and tool cleaning applications in the electronics manufacturing industry. These maintenance cleaning products can be used manually as well as in ultrasonic and spray equipment.
Power Module Cleaning
Cleaning IGBT modules, i.e. DCBs, is an absolute must within the power electronics industry. For one, the substrate surfaces must be prepared for wire bonding after the die attach process. In addition, cleaning is necessary after soldering the substrates onto the cooling element, i.e. “heat sink soldering.”
There are two main requirements for this cleaning process:
Complete removal of flux residues and in particular flux spatter from substrates and chips
Visually flawless and spot-free substrate surfaces and chips, i.e. free of oxide layers
There are two main requirements for this cleaning process:
Complete removal of flux residues and in particular flux spatter from substrates and chips
Visually flawless and spot-free substrate surfaces and chips, i.e. free of oxide layers
Cleaning of Leadframes & Discrete Components
Leadframe-based, discrete components, such as MOSFETs, IGBTs and SOTs are soldered onto the base substrate respectively the leadframe during the die attach process. The usual wire bond connection is partially replaced with the so called clip bonding technology where the connection between the die and lead consists of a copper bridge that is also soldered with a paste. Essentially, when mainly using lead based solder, high peak temperatures during soldering increase the requirements for the cleaning process:
Complete flux removal from the soldering process
Removal of all inorganic stains and activation of the copper surfaces
Material compatibility of the cleaning agent with all materials, e.g. copper and chip passivations
Complete flux removal from the soldering process
Removal of all inorganic stains and activation of the copper surfaces
Material compatibility of the cleaning agent with all materials, e.g. copper and chip passivations
Power LED Cleaning
When manufacturing Power LEDs, cleaning takes places after the die attach process in order to remove flux residues and to properly prepare the substrate and chip surfaces for subsequent wire bonding.
If flux residues on the substrate and specifically flux spatter from the soldering process on the chip surfaces are not completely removed, they can lead to unfavorable bonding conditions. These often result in heel cracks and even chip defects due to unnecessary high bonding power.
If flux residues on the substrate and specifically flux spatter from the soldering process on the chip surfaces are not completely removed, they can lead to unfavorable bonding conditions. These often result in heel cracks and even chip defects due to unnecessary high bonding power.
Flip Chip Cleaning
During the subsequent processing of Flip Chip components into for example BGAs, PGAs, and micro BGAs, the electrical contacts (bumps) will be soldered onto the component base using a reflow process. For the die attach process during the Flip Chip manufacturing, flux pastes (tacky fluxes) are used. These are applied via a dispenser, spraying, or a chip dip process. To achieve a complete and void free wetting of all materials that will subsequently be used for the underfill process, the removal of all flux residues from the tight spaces between the Flip Chip and the base material is an absolute necessity.
CMOS Cleaning
Similar to the subsequent processing of Flip Chip components, when manufacturing CMOS, Flip Chip or BGA-based image sensors are soldered onto the base substrate using a reflow process. For the die attach process, flux pastes are used (tacky fluxes) and applied via dispensers, spray or chip dip processes.
BGA Cleaning After Balling
During the balling process of BGAs and Micro BGAs, the external connections are formed at the base. Normally, premade balls are soldered onto the base using a flux paste. By implementing a cleaning process, the danger of electrochemical migration, leakage currents and corrosion can be reduced.
FAST® Technology
ZESTRON's "Fast Acting Surfactant Technology" (FAST®) is a surfactant-based technology using a completely new generation of surfactants.
This new cleaning technology features shorter and more agile surfactant structures which allows them to move faster on the surface than traditional surfactants.
This new cleaning technology features shorter and more agile surfactant structures which allows them to move faster on the surface than traditional surfactants.
MPC Technology
MPC® stands for Micro Phase Cleaning and is a water-based cleaning technology developed by ZESTRON. Aspects of this Technology are internationally patented.
The unique feature of MPC® Technology is that it combines the advantages of traditional solvents and surfactants without their drawbacks.
The unique feature of MPC® Technology is that it combines the advantages of traditional solvents and surfactants without their drawbacks.
Spray Process
In single chamber spray systems, cleaning occurs according to the dishwasher principle. All of the process steps are executed in the same process chamber. The cleaning medium is sprayed onto the electronic assemblies through nozzle fittings or rotating spray arms. The cleaning effect is generally not achieved through spray jet pressure, as with inline processes, but rather via the volume of cleaning medium passed over the substrates.
Dip Tank Process
In dip tank cleaning systems, assemblies, stencils, solder pallets or machine parts are typically guided through several cleaning stages in which individual cleaning, rinsing and drying steps take place. The agitation of the cleaning medium is achieved through ultrasonic or a spray-under-immersion system.
Ultrasonic Cleaning
Sound is caused by the propagation of pressure and density fluctuations (compression and rarefaction of molecules) in an elastic medium. Frequencies ranging from 20 Hz to 20 kHz, are audible for humans. Vibrations at frequencies exceeding 20 kHz are called ultrasound.
Typical cleaning frequencies range from 35 kHz to 45 kHz. Through ultrasonic transducer elements attached to or directly fixed in the cleaning tank, under-inflation and overpressure waves spread in the cleaning bath. Cavitation creates a pressure jet (microjet) that helps remove the dirt particles from the surface.
Typical cleaning frequencies range from 35 kHz to 45 kHz. Through ultrasonic transducer elements attached to or directly fixed in the cleaning tank, under-inflation and overpressure waves spread in the cleaning bath. Cavitation creates a pressure jet (microjet) that helps remove the dirt particles from the surface.
HFE Co-Solvent Cleaning Process
Modern HFE co-solvent cleaning processes are available options if short process, drying times and/or water-free cleaning is required. This is often utilized in the military and aerospace sectors. HFEs (hydrofluoroethers) were developed as replacements for CFCs or similar solvents exhibiting the following properties: nonflammable, non conductive, dries quickly and residue free.
Together with a co-solvent, the HFE is used in a cleaning bath with spray-under-immersion or ultrasonic agitation in order to dissolve persistent residues. The rinsing step takes place in a bath with HFE only and subsequently with steam rinsing. Finally, the PCBs are dried by intensive cooling. This process must be carried out in a cleaning machine with efficient cooling technology, preventing evaporation of the HFE.
Together with a co-solvent, the HFE is used in a cleaning bath with spray-under-immersion or ultrasonic agitation in order to dissolve persistent residues. The rinsing step takes place in a bath with HFE only and subsequently with steam rinsing. Finally, the PCBs are dried by intensive cooling. This process must be carried out in a cleaning machine with efficient cooling technology, preventing evaporation of the HFE.
One-Chamber Vacuum Process
One-chamber vacuum cleaning works solely with solvents. The cleaning agent is sprayed onto the parts similar to the spray-in-air process while drying takes place in a vacuum environment, substantially reducing process time.
Most solvents have long bath life and due to their efficient drying properties, short process times can be achieved. For one-chamber vacuum processes, the cleaning machine must be explosion-proof.
If you have questions regarding the different cleaning mechanics/ process types or would like to conduct cleaning trials with different cleaning machines at our Technical Center, please contact our Process Engineers.
Most solvents have long bath life and due to their efficient drying properties, short process times can be achieved. For one-chamber vacuum processes, the cleaning machine must be explosion-proof.
If you have questions regarding the different cleaning mechanics/ process types or would like to conduct cleaning trials with different cleaning machines at our Technical Center, please contact our Process Engineers.
Manual Cleaning
In addition to cleaning PCBs, power modules, stencils and machine parts in automated cleaning systems, flux residues, particles, SMT adhesives and solder paste can also be removed manually.
Manual cleaning is often a popular alternative if the throughput is low, e.g. when building prototypes, or during PCBs / electronic component rework or repair. Manual cleaning can be performed immediately and without investing in equipment. If a production facility with medium / high throughput and several shifts requires excellent cleaning results, an automated cleaning process is then preferred.
Manual cleaning is often a popular alternative if the throughput is low, e.g. when building prototypes, or during PCBs / electronic component rework or repair. Manual cleaning can be performed immediately and without investing in equipment. If a production facility with medium / high throughput and several shifts requires excellent cleaning results, an automated cleaning process is then preferred.
Inline Process
For large production throughputs and minimal component diversity, inline systems are a time-efficient and cost-effective solution when cleaning electronic assemblies. The printed circuit boards run automatically on the conveyor belt through the individual process steps, where cleaning, rinsing and drying are performed in separate chambers.
Before deciding on an inline process, its necessary to consider the footprint. Inline machines require larger floor space in comparison to batch cleaning machines. An inline system can only be integrated into the production line when the entry and exit of the assemblies as well as the cleaning itself are fully automated.
Before deciding on an inline process, its necessary to consider the footprint. Inline machines require larger floor space in comparison to batch cleaning machines. An inline system can only be integrated into the production line when the entry and exit of the assemblies as well as the cleaning itself are fully automated.
Cleaning Bath Monitoring
Permanent contamination enters the cleaning and rinsing bath through the cleaning of electronic assemblies. In addition to the contamination, there are also process-dependent influences, such as extraction, evaporation or the spread of cleaner into the rinsing water which can adversely affect the end result.
Regular wash tank monitoring is necessary to ensure consistent results in cleaning processes of electronic assemblies or power electronics. There are manual and automatic methods available.
Regular wash tank monitoring is necessary to ensure consistent results in cleaning processes of electronic assemblies or power electronics. There are manual and automatic methods available.
Cleaning Agent Regeneration & Recovery
To extend the bath life time or to avoid negative impacts on pcbs to be cleaned due to recontamination from the cleaning bath, the operator has different opportunities.
Cleanliness Analysis / Surface Analytics
n order to ensure a reliable coating, moldability and bondability of the pcb assemblies, the surface cleanliness of substrates should be tested on a sample basis before the further processing. If and where residues of fluxes or other particles are present on the printed circuit board is important to know. Various methods are available to the operator.
Cleaners for Power Electronics
Defluxing products for Power Modules, DCBs, IGBTs, Leadframes and Power LEDs
Process Control
Process Optimization Products
Stencil Cleaners
Solder pastes, SMT adhesives or thick film pastes removal from SMT Stencils, Screens and Misprints
Cleanliness & Surface Qualification
At ZESTRON‘s Analytical Center, you have the opportunity to test your entire cleaning process according to international standards such as IPC, MIL or J-STD using a multitude of analytical test methods.
The available processes can be divided into visual, chemical and physical test methods. Thus, all cleaned substrates, such as power modules, PCBs, stencils and tools, as well as the quality of your cleaning bath itself can be analyzed using various techniques.
The available processes can be divided into visual, chemical and physical test methods. Thus, all cleaned substrates, such as power modules, PCBs, stencils and tools, as well as the quality of your cleaning bath itself can be analyzed using various techniques.
About us
With many years’ experience in the design and manufacture of water-based, solvent based and surfactant based cleaners for electronic PCB products and circuit boards, we at Zestron Europe have an extensive amount of technical and analytical support on a global scale.
Leading specialists in SMT electronics cleaning, power electronics and semiconductor cleaning, our team of experienced process engineers have the ability to develop new and innovative solutions and cleaning processes that allow for a fully functioning optimal cleaning system. Our services are reliable, cost effective and highly recommended all over the world.
Here at Zestron, we offer a variety of cleaners for various applications, including printed circuit boards, power modules, semiconductor packages, flip chips, stencils, screens, solder pallets, reflow ovens, wave solder systems, squeegees and many others. Our main aim as a company is to help customers avoid flux activator residues, resin residues to gain the optimum cleaning results for reliable products.
Our impressive range of products help with cleaning agent regeneration and recovery as well has wash bath monitoring (e.g. the ZESTRON EYE) for the best performance and control of the cleaning process.
Zestron Europe not only offers high quality cleaning solutions for SMT and Semiconductor production; we also provide in-depth training and coaching which has allowed individuals to gain more of an understanding of surface cleanliness, conformal coating requirements and optimization of the cleaning process.
With over 3000 successfully installed cleaning process around the world for various industries, e.g. automotive, aviation, telecommunication, medical and others our engineers have the expertise to find the right solution for your specific requirements. Reliability is our driver in every aspect of our work!
We offer a variety of training formats depending on the requirements of the client, such as technology coachings, in-house training and online training. Our training courses have been highly recommended by our loyal customer base for many years, who have praised our hands-on, flexible approach to learning about electronics cleaning.
Our philosophy is to develop our extensive research to the highest possible standard and following environmental and safety procedures. Our company is ISO:9001 certified and ensures high quality and environmentally friendly working processes.
Leading specialists in SMT electronics cleaning, power electronics and semiconductor cleaning, our team of experienced process engineers have the ability to develop new and innovative solutions and cleaning processes that allow for a fully functioning optimal cleaning system. Our services are reliable, cost effective and highly recommended all over the world.
Here at Zestron, we offer a variety of cleaners for various applications, including printed circuit boards, power modules, semiconductor packages, flip chips, stencils, screens, solder pallets, reflow ovens, wave solder systems, squeegees and many others. Our main aim as a company is to help customers avoid flux activator residues, resin residues to gain the optimum cleaning results for reliable products.
Our impressive range of products help with cleaning agent regeneration and recovery as well has wash bath monitoring (e.g. the ZESTRON EYE) for the best performance and control of the cleaning process.
Zestron Europe not only offers high quality cleaning solutions for SMT and Semiconductor production; we also provide in-depth training and coaching which has allowed individuals to gain more of an understanding of surface cleanliness, conformal coating requirements and optimization of the cleaning process.
With over 3000 successfully installed cleaning process around the world for various industries, e.g. automotive, aviation, telecommunication, medical and others our engineers have the expertise to find the right solution for your specific requirements. Reliability is our driver in every aspect of our work!
We offer a variety of training formats depending on the requirements of the client, such as technology coachings, in-house training and online training. Our training courses have been highly recommended by our loyal customer base for many years, who have praised our hands-on, flexible approach to learning about electronics cleaning.
Our philosophy is to develop our extensive research to the highest possible standard and following environmental and safety procedures. Our company is ISO:9001 certified and ensures high quality and environmentally friendly working processes.
