Long lasting Epoxy System resists fuels, acids & other aggressive chemicals
27 October 2010
Developed for coating storage tanks, piping, scrubbers, and processing equipment in the chemical industry, Master Bond EP21ARHT features outstanding chemical, fuel, and acid resistance.
Also widely used in electronic, electrical, and metalworking industries, it can even successfully withstand immersion to 96-98% sulfuric acid and 20% hydrochloric acid for more than a year.
This two component epoxy cures at room temperature with minimal shrinkage, or more rapidly at elevated temperatures. Once fully cured, it produces a bond strength greater than 2,200 psi. EP21ARHT can be thermally cycled over the wide temperature range of -51°c to +204°c (-60ºF to +400ºF).
This system features superior electrical insulation capabilities with a dielectric strength of 440 volts/mil and a low coefficient of thermal expansion of 40-45x10-6 in/in/ºc.
EP21ARHT bonds well to metals, ceramics, glass and many plastics. This epoxy offers a convenient non-critical 2 to 1 mix ratio by weight. It is color coded, with part A being clear and part B amber. Master Bond Polymer System EP21ARHT is available for purchase in pint, quart, gallon, and 5 gallon container kits.
Master Bonds' chemically resistant EP21ARHT is especially designed for coating, bonding, lining, and sealing in applications where exceptional acid resistance is required.
Other Press Releases By This Company
- 19/11/2024 - Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard
- 15/10/2024 - One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications
- 10/09/2024 - Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process
- 15/08/2024 - Non-Drip Epoxy Features Acid Resistance
- 19/07/2024 - Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications
- 26/06/2024 - One Component, Dual Cure Epoxy for Medical Applications
- 17/05/2024 - Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications
- 16/04/2024 - Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity
- 14/03/2024 - One Part Epoxy Changes from Red to Clear Under UV Light
- 13/02/2024 - Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
- 11/01/2024 - Food Grade Epoxy Features Enhanced Chemical Resistance
- 07/12/2023 - Flexible, Thixotropic, One Component Dual Cure Epoxy
- 06/11/2023 - One Part RTV Silicone Passes Non-Cytotoxicity Standards
- 12/10/2023 - Toughened, One Component Epoxy Features High Glass Transition Temperature
- 21/09/2023 - Electrically Insulative Two Component Epoxy Features High Elongation
- 03/08/2023 - Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
- 17/07/2023 - One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
- 03/05/2023 - Thixotropic Epoxy Features Low Coefficient of Thermal Expansion
- 27/04/2023 - Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements
- 15/03/2023 - Dual Curable Adhesive Offers Rapid Fixturing with LED Light
- 09/02/2023 - Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization
- 10/01/2023 - Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications
- 14/11/2022 - Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
- 17/10/2022 - Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications
- 08/09/2022 - Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity
- 02/08/2022 - Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications
- 13/07/2022 - Toughened One Part Epoxy Withstands Thermal Cycling
- 10/06/2022 - Biocompatible UV Curable Adhesive Formulated for TPU Bonding
- 06/05/2022 - Flowable Silicone Offers Thermal Cycling and Shock Resistance
- 11/04/2022 - Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards
- 11/03/2022 - Thermally Conductive Epoxy Features Chemical and High Temperature Resistance
- 04/02/2022 - UL Certified Epoxy Encapsulant Resists Arcing Without Igniting
- 05/01/2022 - Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
- 10/12/2021 - Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy
- 18/10/2021 - Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals
- 24/09/2021 - Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye
- 25/08/2021 - One Component, Graphite Filled Epoxy Features Electrical and Thermal Conductivity
- 20/07/2021 - Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
- 28/06/2021 - Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
- 04/05/2021 - Optically Clear Epoxy Passes ISO 10993-5 Certification for Cytotoxicity
- 15/04/2021 - Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
- 05/03/2021 - Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
- 08/02/2021 - Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
- 20/01/2021 - Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance
- 12/11/2020 - One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
- 14/10/2020 - Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications
- 21/09/2020 - Low Viscosity Epoxy Coating Features Acid Resistance
- 14/09/2020 - Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
- 19/07/2020 - Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation
- 15/06/2020 - B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity
- 14/05/2020 - NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance
- 27/04/2020 - Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity
- 12/03/2020 - Epoxy Features Exceptional Chemical and Heat Resistance
- 03/01/2020 - Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
- 04/11/2019 - Thermally Conductive, Chemically Resistant Epoxy Sealant
- 14/10/2019 - Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
- 22/08/2019 - UV Curing Adhesive Passes NASA Low Outgassing Specifications
- 25/07/2019 - Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
- 12/06/2019 - Optically Clear, Low Viscosity Epoxy System Features High Flexibility
- 15/05/2019 - Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance
- 26/04/2019 - Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
- 05/04/2019 - Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
- 12/03/2019 - Silver Conductive, One Component Epoxy Cures at 80°C
- 04/03/2019 - Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
- 29/01/2019 - Biocompatible, Nanosilica Filled LED Curable Adhesive
- 08/01/2019 - Low Viscosity, Thermally Conductive Underfill Epoxy
- 20/12/2018 - Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance
- 04/12/2018 - NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature
- 29/10/2018 - NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature
- 09/10/2018 - UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
- 03/07/2018 - Epoxy Features Very Low Coefficient of Thermal Expansion
- 08/06/2018 - Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
- 23/05/2018 - One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
- 25/04/2018 - Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
- 06/04/2018 - Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
- 16/03/2018 - 6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
- 23/02/2018 - Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity
- 07/02/2018 - Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
- 15/01/2018 - Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
- 14/12/2017 - Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
- 29/11/2017 - Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance
- 31/10/2017 - Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
- 10/10/2017 - Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
- 18/09/2017 - One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
- 29/08/2017 - High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
- 10/08/2017 - One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications
- 18/07/2017 - Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications
- 29/06/2017 - Rapid Curing Two Component Epoxy Offers Impressive Chemical Resistance and High Bond Strength
- 06/06/2017 - Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
- 18/05/2017 - Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance
- 26/04/2017 - Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation
- 13/04/2017 - Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability
- 15/03/2017 - One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation
- 20/02/2017 - Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity
- 31/01/2017 - Room Temperature Curing Epoxy Features Low Thermal Resistance
- 10/01/2017 - Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations
- 13/12/2016 - Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests
- 23/11/2016 - One Component Elastomeric System Features Excellent Thermal Conductivity
- 31/10/2016 - Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C
- 06/10/2016 - Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications
- 14/09/2016 - Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission
- 25/08/2016 - Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
- 03/08/2016 - Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels
- 19/07/2016 - No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
- 20/06/2016 - Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
- 02/06/2016 - Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life
- 10/05/2016 - One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications
- 22/04/2016 - Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties
- 30/03/2016 - Flexible, One Component, Fast Curing Silicone for Medical Device Applications
- 10/03/2016 - Toughened, High Strength, Two Component Epoxy Offers Chemical, Abrasion and High Temperature Resistance
- 23/02/2016 - Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing specifications
- 09/02/2016 - Non-Yellowing UV Curable System Has Superior Abrasion Resistance
- 15/01/2016 - One Component Epoxy Adhesive Has Ultra Low Thermal Resistance and Meets NASA Low Outgassing Specifications
- 15/12/2015 - Toughened, Room Temperature Curing Epoxy Offers A Long Working Life
- 27/11/2015 - Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
- 03/11/2015 - One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
- 13/10/2015 - High Temperature Resistant, One Part Fluorosilicone Offers Superior Chemical Resistance
- 12/08/2015 - High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements
- 07/07/2015 - One Component, High Strength Epoxy for Structural Bonding Applications
- 18/06/2015 - One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests
- 02/06/2015 - Flexible, Two Component Epoxy Polysulfide System Features High Thermal Conductivity and Excellent Electrical Insulation Properties
- 30/04/2015 - Two Component Epoxy with Ultra Low Thermal Resistance and Superior Electrical Insulation Properties
- 20/03/2015 - Low Stress, Optically Clear, One Part Silicone Meets NASA Low Outgassing Specifications
- 24/02/2015 - Two Component Flame Retardant Epoxy Developed for Aerospace Industry
- 16/02/2015 - Low Viscosity UV Curable System Has Superior Non-Yellowing Properties
- 16/02/2015 - Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion
- 13/02/2015 - Optically Clear, Low Viscosity Epoxy Features a Long Open Time at Room Temperature
- 03/04/2014 - Thermally Stable, Two Part Epoxy Meets NASA Low Outgassing Specifications
- 03/04/2014 - EP21NDFG: Meets FDA Standards for Indirect Food Applications
- 03/04/2014 - UV24TKLO: NASA Low Outgassing Approved
- 25/03/2014 - One Component LED Curable System Meets USP Class VI Specifications for Biocompatibility
- 06/03/2014 - Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating and Sealing Applications
- 07/02/2014 - Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation
- 11/11/2013 - Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity
- 23/10/2013 - Thermally Conductive, Electrically insulative One Part Epoxy for bonding, sealing and glob top applications
- 08/10/2013 - Master Bond launches catalogue for electronics industry
- 01/10/2013 - Non-drip two component Epoxy meets FDA Section 175.105 for indirect food applications
- 17/09/2013 - Thermally Conductive Two Component Silicone meets UL 94V-0 specification for flame retardancy
- 21/08/2013 - Quartz filled Two Component Epoxy features high temperature and chemical resistance
- 07/08/2013 - Low viscosity, Two Component Epoxy has extended working life and low exotherm
- 09/07/2013 - Optically clear, medical grade Epoxy features a high glass transition temperature
- 21/06/2013 - Optically clear, low viscosity, high strength, two part Epoxy System
- 30/05/2013 - New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding
- 16/05/2013 - Addition Cured Silicone Meets USP Class VI and ISO 10993-5 Specifications for Biocompatibility and Cytoxicity
- 09/05/2013 - Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy
- 10/04/2013 - High temperature resistant B-Staged Adhesive film features thermal conductivity and electrical insulation
- 14/03/2013 - Dimensionally Stable UV Curable System with a High Glass Transition Temperature
- 08/02/2013 - Two part Urethane modified Epoxy Gel from Master Bond offers dimensional stability & optical clarity
- 21/01/2013 - Chemical Resistant, High Strength Two Component Epoxy withstands elevated temperatures
- 24/10/2012 - One Component LED Curable System offers exceptionally fast cure speeds
- 03/09/2012 - Dimensionally stable Epoxy based UV curable system with high temperature resistance
- 26/07/2012 - High Strength, One Component Epoxy meets NASA low outgassing specifications
- 25/06/2012 - Flexible, thermally conductive, One Part B-Stage Epoxy resists high temperatures
- 17/05/2012 - Two Component Silicone combines outstanding flexibility and high temperature resistance
- 03/05/2012 - Abrasion resistant, Flexible Adhesive serviceable at Cryogenic temperatures
- 26/03/2012 - New Master Bond chemical resistant, optically clear Adhesive cures upon exposure to UV light
- 27/02/2012 - One Part Epoxy offers exceptionally high tensile strength
- 13/01/2012 - New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved
- 22/11/2011 - High Performance, UV Curable Epoxy with Enhanced Chemical Resistance
- 21/11/2011 - High Performance, UV Curable Epoxy with enhanced chemical resistance
- 18/07/2011 - Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization
- 13/06/2011 - Master Bond low viscosity, room temperature curing Epoxy complies with FDA and USP Class VI requirements
- 20/05/2011 - New versatile Food Grade Epoxy from Master Bond resists high temperatures & harsh conditions
- 20/04/2011 - Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests
- 31/03/2011 - Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions
- 04/03/2011 - Chemically Resistant Epoxy from Master Bond withstands a year in Sulfuric & Hydrochloric Acid!
- 11/02/2011 - Master Bond Silver Conductive Epoxy meets NASA Low Outgassing Standards
- 27/01/2011 - New Master Bond structural adhesive resists extreme high temperature
- 16/12/2010 - Thermally Conductive Epoxy delivers high temperature resistance and outstanding electrical insulation
- 12/11/2010 - Master Bond two part Epoxy conforms with NASA outgassing specifications
