Master Bond two part Epoxy conforms with NASA outgassing specifications
12 November 2010
The two part toughened Epoxy adhesive & sealant from specialists Master Bond, not only meets NASA outgassing specifications, but is also cryogenically serviceable.
Master Bonds' EP21TDCHT-LO two part epoxy adhesive & sealant has been specially formulated for demanding applications where factors like temperature cycling, high vibration and mechanical shock are important factors. The versatile system is used for a wide variety of structural, electronic, aerospace, medical and oil & chemical processing applications. EP21TDCHT-LO has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures. As a toughened system, EP21TDCHT-LO is particularly well suited for bonding dissimilar substrates, especially when there has been differing coefficients of expansion. It has an outstanding service temperature range from 4K to +350ºF.
Other notable features include a shear strength exceeding 2500 psi, a peel strength of greater than 20 pli and a Shore D hardness of greater than 60. The cured epoxy has excellent chemical resistance and is an electrical insulator.
Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.
Other Press Releases By This Company
- 20/12/2024 - Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
- 19/11/2024 - Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard
- 15/10/2024 - One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications
- 10/09/2024 - Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process
- 15/08/2024 - Non-Drip Epoxy Features Acid Resistance
- 19/07/2024 - Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications
- 26/06/2024 - One Component, Dual Cure Epoxy for Medical Applications
- 17/05/2024 - Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications
- 16/04/2024 - Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity
- 14/03/2024 - One Part Epoxy Changes from Red to Clear Under UV Light
- 13/02/2024 - Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
- 11/01/2024 - Food Grade Epoxy Features Enhanced Chemical Resistance
- 07/12/2023 - Flexible, Thixotropic, One Component Dual Cure Epoxy
- 06/11/2023 - One Part RTV Silicone Passes Non-Cytotoxicity Standards
- 12/10/2023 - Toughened, One Component Epoxy Features High Glass Transition Temperature
- 21/09/2023 - Electrically Insulative Two Component Epoxy Features High Elongation
- 03/08/2023 - Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
- 17/07/2023 - One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
- 03/05/2023 - Thixotropic Epoxy Features Low Coefficient of Thermal Expansion
- 27/04/2023 - Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements
- 15/03/2023 - Dual Curable Adhesive Offers Rapid Fixturing with LED Light
- 09/02/2023 - Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization
- 10/01/2023 - Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications
- 14/11/2022 - Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
- 17/10/2022 - Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications
- 08/09/2022 - Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity
- 02/08/2022 - Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications
- 13/07/2022 - Toughened One Part Epoxy Withstands Thermal Cycling
- 10/06/2022 - Biocompatible UV Curable Adhesive Formulated for TPU Bonding
- 06/05/2022 - Flowable Silicone Offers Thermal Cycling and Shock Resistance
- 11/04/2022 - Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards
- 11/03/2022 - Thermally Conductive Epoxy Features Chemical and High Temperature Resistance
- 04/02/2022 - UL Certified Epoxy Encapsulant Resists Arcing Without Igniting
- 05/01/2022 - Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
- 10/12/2021 - Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy
- 18/10/2021 - Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals
- 24/09/2021 - Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye
- 25/08/2021 - One Component, Graphite Filled Epoxy Features Electrical and Thermal Conductivity
- 20/07/2021 - Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
- 28/06/2021 - Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
- 04/05/2021 - Optically Clear Epoxy Passes ISO 10993-5 Certification for Cytotoxicity
- 15/04/2021 - Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
- 05/03/2021 - Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
- 08/02/2021 - Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
- 20/01/2021 - Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance
- 12/11/2020 - One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
- 14/10/2020 - Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications
- 21/09/2020 - Low Viscosity Epoxy Coating Features Acid Resistance
- 14/09/2020 - Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
- 19/07/2020 - Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation
- 15/06/2020 - B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity
- 14/05/2020 - NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance
- 27/04/2020 - Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity
- 12/03/2020 - Epoxy Features Exceptional Chemical and Heat Resistance
- 03/01/2020 - Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
- 04/11/2019 - Thermally Conductive, Chemically Resistant Epoxy Sealant
- 14/10/2019 - Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
- 22/08/2019 - UV Curing Adhesive Passes NASA Low Outgassing Specifications
- 25/07/2019 - Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
- 12/06/2019 - Optically Clear, Low Viscosity Epoxy System Features High Flexibility
- 15/05/2019 - Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance
- 26/04/2019 - Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
- 05/04/2019 - Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
- 12/03/2019 - Silver Conductive, One Component Epoxy Cures at 80°C
- 04/03/2019 - Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
- 29/01/2019 - Biocompatible, Nanosilica Filled LED Curable Adhesive
- 08/01/2019 - Low Viscosity, Thermally Conductive Underfill Epoxy
- 20/12/2018 - Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance
- 04/12/2018 - NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature
- 29/10/2018 - NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature
- 09/10/2018 - UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
- 03/07/2018 - Epoxy Features Very Low Coefficient of Thermal Expansion
- 08/06/2018 - Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
- 23/05/2018 - One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
- 25/04/2018 - Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
- 06/04/2018 - Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
- 16/03/2018 - 6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
- 23/02/2018 - Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity
- 07/02/2018 - Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
- 15/01/2018 - Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
- 14/12/2017 - Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
- 29/11/2017 - Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance
- 31/10/2017 - Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
- 10/10/2017 - Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
- 18/09/2017 - One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
- 29/08/2017 - High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
- 10/08/2017 - One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications
- 18/07/2017 - Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications
- 29/06/2017 - Rapid Curing Two Component Epoxy Offers Impressive Chemical Resistance and High Bond Strength
- 06/06/2017 - Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
- 18/05/2017 - Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance
- 26/04/2017 - Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation
- 13/04/2017 - Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability
- 15/03/2017 - One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation
- 20/02/2017 - Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity
- 31/01/2017 - Room Temperature Curing Epoxy Features Low Thermal Resistance
- 10/01/2017 - Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations
- 13/12/2016 - Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests
- 23/11/2016 - One Component Elastomeric System Features Excellent Thermal Conductivity
- 31/10/2016 - Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C
- 06/10/2016 - Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications
- 14/09/2016 - Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission
- 25/08/2016 - Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
- 03/08/2016 - Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels
- 19/07/2016 - No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
- 20/06/2016 - Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
- 02/06/2016 - Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life
- 10/05/2016 - One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications
- 22/04/2016 - Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties
- 30/03/2016 - Flexible, One Component, Fast Curing Silicone for Medical Device Applications
- 10/03/2016 - Toughened, High Strength, Two Component Epoxy Offers Chemical, Abrasion and High Temperature Resistance
- 23/02/2016 - Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing specifications
- 09/02/2016 - Non-Yellowing UV Curable System Has Superior Abrasion Resistance
- 15/01/2016 - One Component Epoxy Adhesive Has Ultra Low Thermal Resistance and Meets NASA Low Outgassing Specifications
- 15/12/2015 - Toughened, Room Temperature Curing Epoxy Offers A Long Working Life
- 27/11/2015 - Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
- 03/11/2015 - One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
- 13/10/2015 - High Temperature Resistant, One Part Fluorosilicone Offers Superior Chemical Resistance
- 12/08/2015 - High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements
- 07/07/2015 - One Component, High Strength Epoxy for Structural Bonding Applications
- 18/06/2015 - One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests
- 02/06/2015 - Flexible, Two Component Epoxy Polysulfide System Features High Thermal Conductivity and Excellent Electrical Insulation Properties
- 30/04/2015 - Two Component Epoxy with Ultra Low Thermal Resistance and Superior Electrical Insulation Properties
- 20/03/2015 - Low Stress, Optically Clear, One Part Silicone Meets NASA Low Outgassing Specifications
- 24/02/2015 - Two Component Flame Retardant Epoxy Developed for Aerospace Industry
- 16/02/2015 - Low Viscosity UV Curable System Has Superior Non-Yellowing Properties
- 16/02/2015 - Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion
- 13/02/2015 - Optically Clear, Low Viscosity Epoxy Features a Long Open Time at Room Temperature
- 03/04/2014 - Thermally Stable, Two Part Epoxy Meets NASA Low Outgassing Specifications
- 03/04/2014 - EP21NDFG: Meets FDA Standards for Indirect Food Applications
- 03/04/2014 - UV24TKLO: NASA Low Outgassing Approved
- 25/03/2014 - One Component LED Curable System Meets USP Class VI Specifications for Biocompatibility
- 06/03/2014 - Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating and Sealing Applications
- 07/02/2014 - Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation
- 11/11/2013 - Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity
- 23/10/2013 - Thermally Conductive, Electrically insulative One Part Epoxy for bonding, sealing and glob top applications
- 08/10/2013 - Master Bond launches catalogue for electronics industry
- 01/10/2013 - Non-drip two component Epoxy meets FDA Section 175.105 for indirect food applications
- 17/09/2013 - Thermally Conductive Two Component Silicone meets UL 94V-0 specification for flame retardancy
- 21/08/2013 - Quartz filled Two Component Epoxy features high temperature and chemical resistance
- 07/08/2013 - Low viscosity, Two Component Epoxy has extended working life and low exotherm
- 09/07/2013 - Optically clear, medical grade Epoxy features a high glass transition temperature
- 21/06/2013 - Optically clear, low viscosity, high strength, two part Epoxy System
- 30/05/2013 - New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding
- 16/05/2013 - Addition Cured Silicone Meets USP Class VI and ISO 10993-5 Specifications for Biocompatibility and Cytoxicity
- 09/05/2013 - Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy
- 10/04/2013 - High temperature resistant B-Staged Adhesive film features thermal conductivity and electrical insulation
- 14/03/2013 - Dimensionally Stable UV Curable System with a High Glass Transition Temperature
- 08/02/2013 - Two part Urethane modified Epoxy Gel from Master Bond offers dimensional stability & optical clarity
- 21/01/2013 - Chemical Resistant, High Strength Two Component Epoxy withstands elevated temperatures
- 24/10/2012 - One Component LED Curable System offers exceptionally fast cure speeds
- 03/09/2012 - Dimensionally stable Epoxy based UV curable system with high temperature resistance
- 26/07/2012 - High Strength, One Component Epoxy meets NASA low outgassing specifications
- 25/06/2012 - Flexible, thermally conductive, One Part B-Stage Epoxy resists high temperatures
- 17/05/2012 - Two Component Silicone combines outstanding flexibility and high temperature resistance
- 03/05/2012 - Abrasion resistant, Flexible Adhesive serviceable at Cryogenic temperatures
- 26/03/2012 - New Master Bond chemical resistant, optically clear Adhesive cures upon exposure to UV light
- 27/02/2012 - One Part Epoxy offers exceptionally high tensile strength
- 13/01/2012 - New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved
- 22/11/2011 - High Performance, UV Curable Epoxy with Enhanced Chemical Resistance
- 21/11/2011 - High Performance, UV Curable Epoxy with enhanced chemical resistance
- 18/07/2011 - Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization
- 13/06/2011 - Master Bond low viscosity, room temperature curing Epoxy complies with FDA and USP Class VI requirements
- 20/05/2011 - New versatile Food Grade Epoxy from Master Bond resists high temperatures & harsh conditions
- 20/04/2011 - Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests
- 31/03/2011 - Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions
- 04/03/2011 - Chemically Resistant Epoxy from Master Bond withstands a year in Sulfuric & Hydrochloric Acid!
- 11/02/2011 - Master Bond Silver Conductive Epoxy meets NASA Low Outgassing Standards
- 27/01/2011 - New Master Bond structural adhesive resists extreme high temperature
- 16/12/2010 - Thermally Conductive Epoxy delivers high temperature resistance and outstanding electrical insulation
- 27/10/2010 - Long lasting Epoxy System resists fuels, acids & other aggressive chemicals
